Product finder

Select the product

Leafy vegetables
Baby Leaf

Leafy vegetables
Adult vegetables

Brocolis, Cauliflower and Cabbage

Potatoes, carrots and turnips

Onions, Eggplants, Tomatoes, Pumpkin violina



Other (strawberries, blueberries, mango, pineapple, apples...)

Show solutions

Events Exhibitions News

Turatti will be present at PACK EXPO 2024

Turatti a PACK EXPO 2024

Turatti, in Partnership with XNEXT and FBL, at PACK EXPO Chicago: Innovation and Reliability for Fruit and Vegetable Processing

We are pleased to announce Turatti’s participation, in collaboration with XNEXT and FBL, at the prestigious PACK EXPO in Chicago, which will take place from November 3 to 6, 2024, at McCormick Place. This event is a globally renowned showcase for the packaging and food processing sector, offering an ideal platform to present the latest innovations and technological solutions.

The collaboration between Turatti, XNEXT, and FBL marks a new chapter in the evolution of fruit and vegetable processing technologies. The synergy between the reliability of Turatti machines and the advanced technologies of XNEXT and FBL promises to revolutionize the industry, offering cutting-edge solutions that enhance efficiency and quality in production processes.

Visitors to PACK EXPO will have the opportunity to discover the latest innovations developed through this partnership. The solutions presented reflect Turatti’s commitment to maintaining high-quality standards and providing reliable, technologically advanced machinery. The technology from XNEXT and FBL, integrated into Turatti solutions, offers new perspectives for fruit and vegetable processing, ensuring more efficient and safer processes.

Participation in PACK EXPO Chicago represents an important opportunity for Turatti, XNEXT, and FBL to demonstrate how technological innovation and reliability can go hand in hand. The proposed solutions are the result of intense research and development activities aimed at meeting the ever-increasing demands of the global food market.

We invite all interested parties to visit our booth to discover the new technologies firsthand and discuss the potential these innovations can offer to their production processes.

Turatti’s participation at PACK EXPO Chicago, in collaboration with XNEXT and FBL, is an event not to be missed for anyone interested in the latest innovations in fruit and vegetable processing. We look forward to welcoming you from November 3 to 6, 2024, at McCormick Place to share our passion for innovation and quality.

For more information about the event and our solutions, visit our website or contact us directly.

It might also interest you